TY - GEN
T1 - Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions
AU - Han, Ki Jin
AU - Swaminathan, Madhavan
AU - Engin, Ege
PY - 2008
Y1 - 2008
N2 - To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.
AB - To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.
UR - http://www.scopus.com/inward/record.url?scp=51849123859&partnerID=8YFLogxK
U2 - 10.1109/SPI.2008.4558394
DO - 10.1109/SPI.2008.4558394
M3 - Conference contribution
AN - SCOPUS:51849123859
SN - 9781424423187
T3 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
BT - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
T2 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI
Y2 - 12 May 2008 through 15 May 2008
ER -