Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions

Ki Jin Han, Madhavan Swaminathan, Ege Engin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.

Original languageEnglish
Title of host publication12th IEEE Workshop on Signal Propagation on Interconnects, SPI
DOIs
StatePublished - 2008
Event12th IEEE Workshop on Signal Propagation on Interconnects, SPI - Avignon, France
Duration: 12 May 200815 May 2008

Publication series

Name12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Conference

Conference12th IEEE Workshop on Signal Propagation on Interconnects, SPI
Country/TerritoryFrance
CityAvignon
Period12/05/0815/05/08

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