Charge trapping in HfYOx gate dielectrics on strained-Si

B. Majhi, C. Mahata, C. K. Maiti

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

HfYOx gate dielectric has been deposited on strained-Si/Si 0.8Ge0.2 by RF co-sputtering of HfO2 and Y 2O3 targets. Chemical and electrical properties have been demonstrated by x-ray photo electron spectroscopy (XPS), capacitance-voltage (C-V) and leakage current (I-V) characteristics. The reliability characteristics of HfYOx gate dielectric stacks on strained-Si/Si 0.8Ge0.2 have been investigated under different field (2.3-6MV/cm) and constant current stress (10-25mA/cm2) of different amplitude and fluence in order to analyze the degradation of oxide as a function of stress parameters. Oxide trap charge and trap centroid location have been analyzed after constant current stressing.

Original languageEnglish
Title of host publicationECS Transactions - Analytical Techniques for Semiconductor Materials and Process Characterization 6, ALTECH 2009
PublisherElectrochemical Society Inc.
Pages163-168
Number of pages6
Edition3
ISBN (Electronic)9781607680901
ISBN (Print)9781566777407
DOIs
StatePublished - 2009
EventAnalytical Techniques for Semiconductor Materials and Process Characterization 6, ALTECH 2009 - 216th ECS Meeting - Vienna, Austria
Duration: 4 Oct 20099 Oct 2009

Publication series

NameECS Transactions
Number3
Volume25
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceAnalytical Techniques for Semiconductor Materials and Process Characterization 6, ALTECH 2009 - 216th ECS Meeting
Country/TerritoryAustria
CityVienna
Period4/10/099/10/09

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