Combined integral equation based circuit modeling of interconnections in electronic packaging

Ki Jin Han, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit level, and the coupling between the two models can be considered by additional capacitive components.

Original languageEnglish
Title of host publicationIEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509010325
DOIs
StatePublished - 12 Jan 2017
Event17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016 - Miami, United States
Duration: 13 Nov 201616 Nov 2016

Publication series

NameIEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation

Conference

Conference17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016
Country/TerritoryUnited States
CityMiami
Period13/11/1616/11/16

Keywords

  • Capacitance stamping
  • Cylindrical modal basis function
  • Equivalent circuit model
  • Integral equation

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