TY - GEN
T1 - Combined integral equation based circuit modeling of interconnections in electronic packaging
AU - Han, Ki Jin
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2017/1/12
Y1 - 2017/1/12
N2 - For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit level, and the coupling between the two models can be considered by additional capacitive components.
AB - For the electrical modeling of electronic packaging composed of planar and vertical interconnections, this paper presents the combination of two integral equation based circuit extraction methods. Each method, which geometrically accords with planar or cylindrical structures, can generate equivalent circuit elements separately. The planar and cylindrical interconnection models are connected in circuit level, and the coupling between the two models can be considered by additional capacitive components.
KW - Capacitance stamping
KW - Cylindrical modal basis function
KW - Equivalent circuit model
KW - Integral equation
UR - http://www.scopus.com/inward/record.url?scp=85011965375&partnerID=8YFLogxK
U2 - 10.1109/CEFC.2016.7816187
DO - 10.1109/CEFC.2016.7816187
M3 - Conference contribution
AN - SCOPUS:85011965375
T3 - IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation
BT - IEEE CEFC 2016 - 17th Biennial Conference on Electromagnetic Field Computation
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 17th Biennial IEEE Conference on Electromagnetic Field Computation, IEEE CEFC 2016
Y2 - 13 November 2016 through 16 November 2016
ER -