Abstract
The structural, chemical, and electrical properties of amorphous indium gallium zinc oxide (a-IGZO) films by magnetron sputtering and atomic layer deposition (ALD) were investigated where both a-IGZO films had a comparable cation composition. The ALD-derived a-IGZO film exhibited the higher atomic packing density, the effective suppression of trap-like oxygen vacancy defect (VO), and the enhancement in the hybridization of the sp orbital of In, Ga, and Zn cations compared to those of the sputtered a-IGZO film. Hence, a significant improvement in terms of the field-effect mobility was observed for the thin-film transistors with an In0.50Ga0.34Zn0.16O channel by ALD (36.6 cm2/V·s) compared to that of the sputtered In0.48Ga0.38Zn0.14O transistor (20.1 cm2/V·s); the ION/OFF ratios for both were 107. Simultaneously, the gate bias stress stability and photobias stress stability were also improved for the IGZO transistors with an ALD-derived channel, which can be explained by its reduced trap-like VO density.
Original language | English |
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Article number | 8653874 |
Pages (from-to) | 1783-1788 |
Number of pages | 6 |
Journal | IEEE Transactions on Electron Devices |
Volume | 66 |
Issue number | 4 |
DOIs | |
State | Published - Apr 2019 |
Keywords
- Atomic layer deposition (ALD)
- indium gallium zinc oxide (IGZO)
- sputtering
- thin-film transistors (TFTs)