Comparative Study on Performance of IGZO Transistors With Sputtered and Atomic Layer Deposited Channel Layer

  • Min Hoe Cho
  • , Hyunju Seol
  • , Aeran Song
  • , Seonjun Choi
  • , Yunheub Song
  • , Pil Sang Yun
  • , Kwun Bum Chung
  • , Jong Uk Bae
  • , Kwon Shik Park
  • , Jae Kyeong Jeong

Research output: Contribution to journalArticlepeer-review

113 Scopus citations

Abstract

The structural, chemical, and electrical properties of amorphous indium gallium zinc oxide (a-IGZO) films by magnetron sputtering and atomic layer deposition (ALD) were investigated where both a-IGZO films had a comparable cation composition. The ALD-derived a-IGZO film exhibited the higher atomic packing density, the effective suppression of trap-like oxygen vacancy defect (VO), and the enhancement in the hybridization of the sp orbital of In, Ga, and Zn cations compared to those of the sputtered a-IGZO film. Hence, a significant improvement in terms of the field-effect mobility was observed for the thin-film transistors with an In0.50Ga0.34Zn0.16O channel by ALD (36.6 cm2/V·s) compared to that of the sputtered In0.48Ga0.38Zn0.14O transistor (20.1 cm2/V·s); the ION/OFF ratios for both were 107. Simultaneously, the gate bias stress stability and photobias stress stability were also improved for the IGZO transistors with an ALD-derived channel, which can be explained by its reduced trap-like VO density.

Original languageEnglish
Article number8653874
Pages (from-to)1783-1788
Number of pages6
JournalIEEE Transactions on Electron Devices
Volume66
Issue number4
DOIs
StatePublished - Apr 2019

Keywords

  • Atomic layer deposition (ALD)
  • indium gallium zinc oxide (IGZO)
  • sputtering
  • thin-film transistors (TFTs)

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