Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems

Biancun Xie, Madhavan Swaminathan, Ki Jin Han, Jianyong Xie

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

35 Scopus citations

Abstract

This paper investigates the coupling effect between through-silicon vias (TSVs) in large TSV array structures. A coupling analysis method for large TSV arrays is proposed. Using this method the importance of coupling between TSVs for low resistivity silicon substrates is quantified both in the frequency and time domain. This has been compared with high resistivity silicon substrates. The comparison between the two indicates the importance of jitter and voltage analysis in TSV arrays for low resistivity silicon substrates due to enhanced coupling.

Original languageEnglish
Title of host publicationEMC 2011 - Proceedings
Subtitle of host publication2011 IEEE International Symposium on Electromagnetic Compatibility
Pages16-21
Number of pages6
DOIs
StatePublished - 2011
Event2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011 - Long Beach, CA, United States
Duration: 14 Aug 201119 Aug 2011

Publication series

NameIEEE International Symposium on Electromagnetic Compatibility
ISSN (Print)1077-4076

Conference

Conference2011 IEEE International Symposium on Electromagnetic Compatibility, EMC 2011
Country/TerritoryUnited States
CityLong Beach, CA
Period14/08/1119/08/11

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