TY - JOUR
T1 - Crystallization-Induced Interface Control in Poly-Si Flash for High-Accuracy Neuromorphic Inference
AU - Ryu, Donghyun
AU - Park, Suyong
AU - Kim, Gimun
AU - Lee, Hyeon Ho
AU - Kim, Sungjoon
AU - Kim, Sungjun
AU - Choi, Woo Young
N1 - Publisher Copyright:
© 2025 American Chemical Society
PY - 2025/11/11
Y1 - 2025/11/11
N2 - This paper presents a comprehensive analysis of the impact of polycrystalline silicon (poly-Si) channel formation methods on the electrical characteristics of charge-trap flash (CTF) memory, with particular attention to their suitability for synaptic applications in neuromorphic systems. T wo types of poly-Si formation methods, low-pressure chemical vapor deposition (LPCVD) and solid-phase crystallization (SPC), were experimentally evaluated and compared. First, the surface roughness of SPC poly-Si was verified to be 9.39× lower than that of LPCVD poly-Si, effectively reducing local electric field concentration. This mitigates read disturbance and overprogramming effects, consequently enabling 2.29× more reliable conductance states. Second, a smaller grain size was confirmed in LPCVD poly-Si, contributing to reduced power consumption. However, the rough surface morphology of LPCVD poly-Si significantly limits its applicability in reliable analog operations. Therefore, the grain size of SPC poly-Si was further optimized by adjusting the annealing conditions, aiming to achieve low-power operation while maintaining superior analogue performance and reliability. As a result, it was confirmed that lower annealing temperatures resulted in smaller grain sizes, leading to a 60% reduction in drive current. Finally, CNN-based image classification on the CIFAR-10 data set demonstrated a 3.98%
AB - This paper presents a comprehensive analysis of the impact of polycrystalline silicon (poly-Si) channel formation methods on the electrical characteristics of charge-trap flash (CTF) memory, with particular attention to their suitability for synaptic applications in neuromorphic systems. T wo types of poly-Si formation methods, low-pressure chemical vapor deposition (LPCVD) and solid-phase crystallization (SPC), were experimentally evaluated and compared. First, the surface roughness of SPC poly-Si was verified to be 9.39× lower than that of LPCVD poly-Si, effectively reducing local electric field concentration. This mitigates read disturbance and overprogramming effects, consequently enabling 2.29× more reliable conductance states. Second, a smaller grain size was confirmed in LPCVD poly-Si, contributing to reduced power consumption. However, the rough surface morphology of LPCVD poly-Si significantly limits its applicability in reliable analog operations. Therefore, the grain size of SPC poly-Si was further optimized by adjusting the annealing conditions, aiming to achieve low-power operation while maintaining superior analogue performance and reliability. As a result, it was confirmed that lower annealing temperatures resulted in smaller grain sizes, leading to a 60% reduction in drive current. Finally, CNN-based image classification on the CIFAR-10 data set demonstrated a 3.98%
KW - charge-trap flash memory
KW - convolution neural network
KW - low power operation
KW - neuromorphic system
KW - poly crystalline silicon
KW - solid-phase crystallization
UR - https://www.scopus.com/pages/publications/105021845824
U2 - 10.1021/acsaelm.5c01668
DO - 10.1021/acsaelm.5c01668
M3 - Article
AN - SCOPUS:105021845824
SN - 2637-6113
VL - 7
SP - 9830
EP - 9837
JO - ACS Applied Electronic Materials
JF - ACS Applied Electronic Materials
IS - 21
ER -