TY - GEN
T1 - Cylindrical conduction mode basis functions for modeling of inductive couplings in System-in-Package (SiP)
AU - Han, Ki Jin
AU - Engin, Ege
AU - Swaminathan, Madhavan
PY - 2007
Y1 - 2007
N2 - PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in System-in-Package. Combination of a few basis functions accurately describes highfrequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.
AB - PEEC method with global basis functions on the cylindrical coordinates is presented for efficient modeling of bond wires in System-in-Package. Combination of a few basis functions accurately describes highfrequency effects of closely located wires with shorter simulation time compared to the conventional PEEC method. Simplified equivalent circuit from the proposed method is also favorable for modeling of large coupling structures.
UR - http://www.scopus.com/inward/record.url?scp=47949131302&partnerID=8YFLogxK
U2 - 10.1109/EPEP.2007.4387203
DO - 10.1109/EPEP.2007.4387203
M3 - Conference contribution
AN - SCOPUS:47949131302
SN - 1424408830
SN - 9781424408832
T3 - IEEE Topical Meeting on Electrical Performance of Electronic Packaging
SP - 361
EP - 364
BT - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
T2 - IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Y2 - 29 October 2007 through 31 October 2007
ER -