Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

B. S. Ko, T. J. Baek, D. H. Shin, S. C. Kim, B. O. Lim, H. S. Lee, S. K. Kim, H. C. Park, Y. H. Chun, J. K. Rhee

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.

Original languageEnglish
Pages (from-to)675-676
Number of pages2
JournalElectronics Letters
Volume40
Issue number11
DOIs
StatePublished - 27 May 2004

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