Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

  • B. S. Ko
  • , T. J. Baek
  • , D. H. Shin
  • , S. C. Kim
  • , B. O. Lim
  • , H. S. Lee
  • , S. K. Kim
  • , H. C. Park
  • , Y. H. Chun
  • , J. K. Rhee

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.

Original languageEnglish
Pages (from-to)675-676
Number of pages2
JournalElectronics Letters
Volume40
Issue number11
DOIs
StatePublished - 27 May 2004

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