Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

B. S. Ko; T. J. Baek; D. H. Shin; S. C. Kim; B. O. Lim; H. S. Lee; S. K. Kim; H. C. Park; Y. H. Chun; J. K. Rhee

doi:10.1049/el:20040418

Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

B. S. Ko
, T. J. Baek
, D. H. Shin
, S. C. Kim
, B. O. Lim
, H. S. Lee
, S. K. Kim
, H. C. Park
, Y. H. Chun
, J. K. Rhee

Department of Electronics & Electrical Engineering

Dongguk University

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.

Original language	English
Pages (from-to)	675-676
Number of pages	2
Journal	Electronics Letters
Volume	40
Issue number	11
DOIs	https://doi.org/10.1049/el:20040418
State	Published - 27 May 2004

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10.1049/el:20040418

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title = "Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines",

abstract = "A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.",

author = "Ko, \{B. S.\} and Baek, \{T. J.\} and Shin, \{D. H.\} and Kim, \{S. C.\} and Lim, \{B. O.\} and Lee, \{H. S.\} and Kim, \{S. K.\} and Park, \{H. C.\} and Chun, \{Y. H.\} and Rhee, \{J. K.\}",

year = "2004",

month = may,

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doi = "10.1049/el:20040418",

language = "English",

volume = "40",

pages = "675--676",

journal = "Electronics Letters",

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T1 - Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

AU - Ko, B. S.

AU - Baek, T. J.

AU - Shin, D. H.

AU - Kim, S. C.

AU - Lim, B. O.

AU - Lee, H. S.

AU - Kim, S. K.

AU - Park, H. C.

AU - Chun, Y. H.

AU - Rhee, J. K.

PY - 2004/5/27

Y1 - 2004/5/27

N2 - A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.

AB - A 180° hybrid ring coupler has been designed and fabricated to prove the possibility of the fabrication for various passive components at high frequency using newly proposed transmission lines, i.e. dielectric-supported air-gapped microstripline structures.

UR - https://www.scopus.com/pages/publications/2942754137

U2 - 10.1049/el:20040418

DO - 10.1049/el:20040418

M3 - Article

AN - SCOPUS:2942754137

SN - 0013-5194

VL - 40

SP - 675

EP - 676

JO - Electronics Letters

JF - Electronics Letters

IS - 11

ER -

Design and fabrication of 180° hybrid ring coupler for applications of MMICs using dielectric-supported air-gapped microstriplines

Abstract

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