TY - GEN
T1 - Design of a 6-bit IGSPS fully folded CMOS A/D converter for Ultra Wide Band (UWB) applications
AU - Lee, Doobock
AU - Yeo, Seungjin
AU - Kang, Heewon
AU - Kim, Daeyoon
AU - Moon, Junho
AU - Song, Minkyu
PY - 2008
Y1 - 2008
N2 - In this paper, a CMOS analog-to-digital converter (ADC) for Ultra Wide Band (UWB) applications with a 6-bit IGSPS at 1.8V is described. The architecture of the proposed ADC is based on a fully folded ADC using resistive interpolation technique for low power consumption. To reduce the power consumption, a folder reduction technique to decrease the number of folding blocks (NFB) is proposed. Further, a novel layout technique is introduced for compact area. With the clock speed of IGHz, the ADC achieves an effective resolution bandwidth (ERBW) of 200MHz, while consuming only 60mW of power. The measured INL and DNL are within ±0.7LSB, ±0.5LSB, respectively. The measured SNDR is 33.64dB, when Fin=100MHz at Fs=IGHz. The active chip occupies an area of 0.27mm2 in 0.18μm CMOS technology.
AB - In this paper, a CMOS analog-to-digital converter (ADC) for Ultra Wide Band (UWB) applications with a 6-bit IGSPS at 1.8V is described. The architecture of the proposed ADC is based on a fully folded ADC using resistive interpolation technique for low power consumption. To reduce the power consumption, a folder reduction technique to decrease the number of folding blocks (NFB) is proposed. Further, a novel layout technique is introduced for compact area. With the clock speed of IGHz, the ADC achieves an effective resolution bandwidth (ERBW) of 200MHz, while consuming only 60mW of power. The measured INL and DNL are within ±0.7LSB, ±0.5LSB, respectively. The measured SNDR is 33.64dB, when Fin=100MHz at Fs=IGHz. The active chip occupies an area of 0.27mm2 in 0.18μm CMOS technology.
KW - ADC
KW - Folding/interpolation
KW - Low power
KW - UWB
UR - http://www.scopus.com/inward/record.url?scp=51849133100&partnerID=8YFLogxK
U2 - 10.1109/ICICDT.2008.4567258
DO - 10.1109/ICICDT.2008.4567258
M3 - Conference contribution
AN - SCOPUS:51849133100
SN - 9781424418114
T3 - Proceedings - 2008 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
SP - 113
EP - 116
BT - Proceedings - 2008 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT
T2 - IEEE International Conference on Integrated Circuit Design and Technology, ICICDT 2008
Y2 - 2 June 2008 through 4 June 2008
ER -