Abstract
This paper describes a new GaAs-based micromachined microstrip line with elevated and overlaid signal line with ground metal. This new type of overlay microstrip line (OML) structure is developed using micromachining techniques to provide easy means of airbridge connection between the signal lines, as well as to achieve low losses over wide impedance ranges.
Original language | English |
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Pages (from-to) | 283-286 |
Number of pages | 4 |
Journal | Institute of Physics Conference Series |
Volume | 174 |
State | Published - 2003 |
Event | Compound Semiconductors 2002 - Proceedings of the Twenty-Ninth International Symposium on Compound Semiconductors - Lausanne, Switzerland Duration: 7 Oct 2002 → 10 Oct 2002 |