Design of low loss transmission lines on GaAs substrates using the surface micromachining methods

Young Hoon Chun, Sung Chan Kim, Byoung Ok Lim, Han Shin Lee, Moon Kyo Lee, Hae Sung Kim, Dong Hoon Shin, Soon Koo Kim, Hyun Chang Park, Jin Koo Rhee, Sang Won Yun

Research output: Contribution to journalConference articlepeer-review

Abstract

This paper describes a new GaAs-based micromachined microstrip line with elevated and overlaid signal line with ground metal. This new type of overlay microstrip line (OML) structure is developed using micromachining techniques to provide easy means of airbridge connection between the signal lines, as well as to achieve low losses over wide impedance ranges.

Original languageEnglish
Pages (from-to)283-286
Number of pages4
JournalInstitute of Physics Conference Series
Volume174
StatePublished - 2003
EventCompound Semiconductors 2002 - Proceedings of the Twenty-Ninth International Symposium on Compound Semiconductors - Lausanne, Switzerland
Duration: 7 Oct 200210 Oct 2002

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