Abstract
In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.
Original language | English |
---|---|
Pages | 1421-1422 |
Number of pages | 2 |
State | Published - 2005 |
Event | IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005 - Takamatsu, Japan Duration: 6 Dec 2005 → 9 Dec 2005 |
Conference
Conference | IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005 |
---|---|
Country/Territory | Japan |
City | Takamatsu |
Period | 6/12/05 → 9/12/05 |