Development of conductive ball for fine pitch interconnection

S. J. Hong, M. J. Lee, J. H. Choi, C. J. Lee, W. G. Kim, G. W. Jeong, J. I. Han

Research output: Contribution to conferencePaperpeer-review

Abstract

In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.

Original languageEnglish
Pages1421-1422
Number of pages2
StatePublished - 2005
EventIDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005 - Takamatsu, Japan
Duration: 6 Dec 20059 Dec 2005

Conference

ConferenceIDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005
Country/TerritoryJapan
CityTakamatsu
Period6/12/059/12/05

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