Development of conductive ball for fine pitch interconnection

S. J. Hong; M. J. Lee; J. H. Choi; C. J. Lee; W. G. Kim; G. W. Jeong; J. I. Han

Development of conductive ball for fine pitch interconnection

S. J. Hong
, M. J. Lee
, J. H. Choi
, C. J. Lee
, W. G. Kim
, G. W. Jeong
, J. I. Han

Department of Chemical and Biochemical Engineering

Korea Electronics Technology Institute
Jeong Eui Ind Co. Ltd.

Research output: Contribution to conference › Paper › peer-review

Abstract

In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.

Original language	English
Pages	1421-1422
Number of pages	2
State	Published - 2005
Event	IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005 - Takamatsu, Japan Duration: 6 Dec 2005 → 9 Dec 2005

Conference

Conference	IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005
Country/Territory	Japan
City	Takamatsu
Period	6/12/05 → 9/12/05

Cite this

@conference{20fecbc349c24727b68d6dc648433fc1,

title = "Development of conductive ball for fine pitch interconnection",

abstract = "In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10\% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39\%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.",

author = "Hong, \{S. J.\} and Lee, \{M. J.\} and Choi, \{J. H.\} and Lee, \{C. J.\} and Kim, \{W. G.\} and Jeong, \{G. W.\} and Han, \{J. I.\}",

year = "2005",

language = "English",

pages = "1421--1422",

note = "IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005 ; Conference date: 06-12-2005 Through 09-12-2005",

}

TY - CONF

T1 - Development of conductive ball for fine pitch interconnection

AU - Hong, S. J.

AU - Lee, M. J.

AU - Choi, J. H.

AU - Lee, C. J.

AU - Kim, W. G.

AU - Jeong, G. W.

AU - Han, J. I.

PY - 2005

Y1 - 2005

N2 - In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.

AB - In this work, micro-sized conductive elastic ball was successfully fabricated for fine pitch interconnection. First, 2.8 μm sized ball with small deviation of 10% was successfully synthesized. Its deformation shows elastic behavior between 31 and 39%. Also, electrically conductive layer of Au/Ni was successfully fabricated by electrolessplating. The plated layer shows good adhesion with the surface of the organic ball. So, elastic micro ball could be fabricated for fine pitch interconnection.

UR - https://www.scopus.com/pages/publications/33644601360

M3 - Paper

AN - SCOPUS:33644601360

SP - 1421

EP - 1422

T2 - IDW/AD'05 - 12th International Display Workshops in Conjunction with Asia Display 2005

Y2 - 6 December 2005 through 9 December 2005

ER -

Development of conductive ball for fine pitch interconnection

Abstract

Conference

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