Abstract
Effects of the N2O plasma treatment (PT) on perhydropolysilazane spin-on-dielectric (PHPS SOD) were examined as potential inter-layer- dielectrics (ILDs) for sub-30 nm Si circuits. The spin-coated PHPS (18.5 wt.%) ILD layers converted at 650 C were integrated with the 0.18 μm Si front-end-of-the line process. A modified contact pre-cleaning scheme using N2O PT produced more uniform and stable contact chain resistances from the SOD ILDs than the case of pre-cleaning only by buffered oxide etcher. Our analysis shows that this enhancement is due to the minimized carbon contamination on the PHPS side-wall surface densified by PT.
Original language | English |
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Pages (from-to) | 57-60 |
Number of pages | 4 |
Journal | Thin Solid Films |
Volume | 551 |
DOIs | |
State | Published - 31 Jan 2014 |
Keywords
- Inter-layer-dielectric
- NO plasma treatment
- Perhydropolysilazane
- Spin-on-dielectric