Effects of plasma nitridation on the electrical properties of nitrided oxide gate dielectric for DRAM application

Jin Hwa Heo, Dong Chan Kim, Bon Young Koo, Ji Hyun Kim, Chul Sung Kim, Young Jin Noh, Sung Kweon Baek, Yu Gyun Shin, U. In Chung, Joo Tae Moon, Mann Ho Cho, Kwun Bum Chung, Dae Won Moon

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

We reduced the gate tunnelling current by seven times and suppressed NBTI using plasma nitridation-induced re-oxidation (PIROX). In plasma nitrided gate oxynitride, the nitrogen concentration at the MOS interface is determined after plasma nitridation process, which affects the electrical and physical properties of gate oxynitride. To facilitate the control of nitrogen concentration at the MOS interface, an additional reoxidation process is needed, but decreasing the nitrogen concentration. In this paper, the plasma nitridation process is proposed that realizes simultaneously the nitridation and re-oxidation without an additional process and the decrease of nitrogen concentration. The control of nitrogen concentration and the amount of re-oxidation under high pressure process improves the gate tunnelling current, mobility, and NBTI.

Original languageEnglish
Title of host publicationProceedings of ESSDERC 2005
Subtitle of host publication35th European Solid-State Device Research Conference
Pages205-208
Number of pages4
DOIs
StatePublished - 2005
EventESSDERC 2005: 35th European Solid-State Device Research Conference - Grenoble, France
Duration: 12 Sep 200516 Sep 2005

Publication series

NameProceedings of ESSDERC 2005: 35th European Solid-State Device Research Conference
Volume2005

Conference

ConferenceESSDERC 2005: 35th European Solid-State Device Research Conference
Country/TerritoryFrance
CityGrenoble
Period12/09/0516/09/05

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