Abstract
The effects of reoxidation on the band structure of N-incorporated SiON films were investigated as a function of thermal treatment in NO and N H3. Reoxidation-associated changes in band gap and valence band offset of the N-incorporated SiON films prepared by sequential thermal annealing in both NO and N H3 were less than those observed for the nitrided film prepared by thermal annealing in only N H3. The differences in band-alignment characteristics of the nitrided films that resulted from use of different nitridation methods were strongly related to the depth distribution of N and the chemical states of N bonded to Si.
Original language | English |
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Article number | 012901 |
Journal | Applied Physics Letters |
Volume | 93 |
Issue number | 1 |
DOIs | |
State | Published - 2008 |