Efficient computation of capacitive coupling between planar and cylindrical interconnections

Ki Jin Han; Madhavan Swaminathan

doi:10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections

Ki Jin Han, Madhavan Swaminathan

Department of Electronics & Electrical Engineering

Georgia Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.

Original language	English
Title of host publication	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	13-16
Number of pages	4
ISBN (Electronic)	9781479962570
DOIs	https://doi.org/10.1109/EDAPS.2014.7030803
State	Published - 2014
Event	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 - Bangalore, India Duration: 14 Dec 2014 → 16 Dec 2014

Publication series

Name	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014

Conference

Conference	2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014
Country/Territory	India
City	Bangalore
Period	14/12/14 → 16/12/14

Access to Document

10.1109/EDAPS.2014.7030803

Cite this

Han, K. J., & Swaminathan, M. (2014). Efficient computation of capacitive coupling between planar and cylindrical interconnections. In 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 (pp. 13-16). Article 7030803 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EDAPS.2014.7030803

Han, Ki Jin ; Swaminathan, Madhavan. / Efficient computation of capacitive coupling between planar and cylindrical interconnections. 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. pp. 13-16 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014).

@inproceedings{74a6409ded504f2abfa89ff6b30b0e03,

title = "Efficient computation of capacitive coupling between planar and cylindrical interconnections",

abstract = "For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.",

author = "Han, {Ki Jin} and Madhavan Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014 ; Conference date: 14-12-2014 Through 16-12-2014",

year = "2014",

doi = "10.1109/EDAPS.2014.7030803",

language = "English",

series = "2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "13--16",

booktitle = "2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014",

address = "United States",

}

Han, KJ & Swaminathan, M 2014, Efficient computation of capacitive coupling between planar and cylindrical interconnections. in 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014., 7030803, 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014, Institute of Electrical and Electronics Engineers Inc., pp. 13-16, 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014, Bangalore, India, 14/12/14. https://doi.org/10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections. / Han, Ki Jin; Swaminathan, Madhavan.
2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 13-16 7030803 (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Efficient computation of capacitive coupling between planar and cylindrical interconnections

AU - Han, Ki Jin

AU - Swaminathan, Madhavan

PY - 2014

Y1 - 2014

N2 - For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.

AB - For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%.

UR - http://www.scopus.com/inward/record.url?scp=84936135693&partnerID=8YFLogxK

U2 - 10.1109/EDAPS.2014.7030803

DO - 10.1109/EDAPS.2014.7030803

M3 - Conference contribution

AN - SCOPUS:84936135693

T3 - 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014

SP - 13

EP - 16

BT - 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014

Y2 - 14 December 2014 through 16 December 2014

ER -

Han KJ, Swaminathan M. Efficient computation of capacitive coupling between planar and cylindrical interconnections. In 2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014. Institute of Electrical and Electronics Engineers Inc. 2014. p. 13-16. 7030803. (2014 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2014). doi: 10.1109/EDAPS.2014.7030803

Efficient computation of capacitive coupling between planar and cylindrical interconnections

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this