Electrical and physical parametric study of high-speed link performance

Ki Jin Han; Mark B. Ritter; Xiaoxiong Gu

doi:10.1109/EPEPS.2010.5642589

Electrical and physical parametric study of high-speed link performance

Ki Jin Han
, Mark B. Ritter
, Xiaoxiong Gu

Department of Electronics & Electrical Engineering

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

This paper introduces an efficient environment for parametric and statistical studies of electrical link performance. With this simulation environment and its use of systematic input and output files, the effects of both physical and electrical design parameters can be readily observed. In addition, supported by fast electromagnetic and link simulators, the environment enables the extensive studies of electrical links by considering the effects of changing many design parameters. An exemplary parametric study in this paper shows the usefulness of the simulation environment for various future applications.

Original language	English
Title of host publication	2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010
Publisher	IEEE Computer Society
Pages	229-232
Number of pages	4
ISBN (Print)	9781424468652
DOIs	https://doi.org/10.1109/EPEPS.2010.5642589
State	Published - 2010

Publication series

Name	2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010

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10.1109/EPEPS.2010.5642589

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Han, K. J., Ritter, M. B., & Gu, X. (2010). Electrical and physical parametric study of high-speed link performance. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010 (pp. 229-232). Article 5642589 (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). IEEE Computer Society. https://doi.org/10.1109/EPEPS.2010.5642589

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title = "Electrical and physical parametric study of high-speed link performance",

abstract = "This paper introduces an efficient environment for parametric and statistical studies of electrical link performance. With this simulation environment and its use of systematic input and output files, the effects of both physical and electrical design parameters can be readily observed. In addition, supported by fast electromagnetic and link simulators, the environment enables the extensive studies of electrical links by considering the effects of changing many design parameters. An exemplary parametric study in this paper shows the usefulness of the simulation environment for various future applications.",

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series = "2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010",

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Han, KJ, Ritter, MB & Gu, X 2010, Electrical and physical parametric study of high-speed link performance. in 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010., 5642589, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, IEEE Computer Society, pp. 229-232. https://doi.org/10.1109/EPEPS.2010.5642589

Electrical and physical parametric study of high-speed link performance. / Han, Ki Jin; Ritter, Mark B.; Gu, Xiaoxiong.
2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, 2010. p. 229-232 5642589 (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This paper introduces an efficient environment for parametric and statistical studies of electrical link performance. With this simulation environment and its use of systematic input and output files, the effects of both physical and electrical design parameters can be readily observed. In addition, supported by fast electromagnetic and link simulators, the environment enables the extensive studies of electrical links by considering the effects of changing many design parameters. An exemplary parametric study in this paper shows the usefulness of the simulation environment for various future applications.

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Han KJ, Ritter MB, Gu X. Electrical and physical parametric study of high-speed link performance. In 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society. 2010. p. 229-232. 5642589. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010). doi: 10.1109/EPEPS.2010.5642589

Electrical and physical parametric study of high-speed link performance

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