Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions

Ki Jin Han, Madhavan Swaminathan, Ege Engin

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.

Original languageEnglish
Title of host publication2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
Pages1225-1230
Number of pages6
DOIs
StatePublished - 2008
Event2008 58th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: 27 May 200830 May 2008

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2008 58th Electronic Components and Technology Conference, ECTC
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period27/05/0830/05/08

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