TY - GEN
T1 - Electrical modeling of wirebonds in stacked ICs using cylindrical conduction mode basis functions
AU - Han, Ki Jin
AU - Swaminathan, Madhavan
AU - Engin, Ege
PY - 2008
Y1 - 2008
N2 - This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.
AB - This paper discusses an efficient method for simulation and modeling of three-dimensional (3-D) interconnections such as wire bonds and through-hole vias. The proposed method is based on the volume electric field integral equation (EFIE), and approximates current density distribution with cylindrical conduction mode basis functions (CMBF). The geometrical fitness and orthogonal property of the basis functions are found useful in capturing skin effect and current crowding in cylindrical conductors. The Analyses of wire bonds using the proposed method demonstrate various 3-D coupling issues including wire bending effect, vertical coupling, and ground wiring.
UR - http://www.scopus.com/inward/record.url?scp=51349126266&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2008.4550131
DO - 10.1109/ECTC.2008.4550131
M3 - Conference contribution
AN - SCOPUS:51349126266
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1225
EP - 1230
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -