Electrodeposition and nucleation of copper at nitrogen-incorporated tetrahedral amorphous carbon electrodes in basic ambient temperature chloroaluminate melts

Jae Joon Lee, Barry Miller, Xu Shi, Rafi Kalish, Kraig A. Wheeler

Research output: Contribution to journalArticlepeer-review

31 Scopus citations

Abstract

The electrodeposition of copper on the atomically smooth nitrogen-incorporated tetrahedral amorphous carbon (taC:N) electrode has been studied in basic ambient temperature AICl3/l-ethyl-3-methylimidazolium chloroaluminate melts. A high overpotential for nucleation of copper on taC:N and no underpotential deposition features are observed, comparable to the behavior of boron-doped diamond electrodes. Electrochemical deposition and stripping of copper on taC:N show that most of the deposit is anodically dissolved only when the potential reaches that of Cu(I) oxidation in a system in which Cu(I) and Cu(II) are both stable. The low-density of intrinsic active sites for nucleation and its early saturation with increasing overpotential are responsible for the slight deviation from a model of the ideal progressive type of nucleation at high overpotentials.

Original languageEnglish
Pages (from-to)C183-C190
JournalJournal of the Electrochemical Society
Volume148
Issue number3
DOIs
StatePublished - 2001

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