Abstract
This paper proposes an efficient method to model through-silicon via (TSV) interconnections, an essential building block for the realization of silicon-based 3-D systems. The proposed method results in equivalent network parameters that include the combined effect of conductor, insulator, and silicon substrate. Although the modeling method is based on solving Maxwell's equation in integral form, the method uses a small number of global modal basis functions and can be much faster than discretization-based integral-equation methods. Through comparison with 3-D full-wave simulations, this paper validates the accuracy and the efficiency of the proposed modeling method.
Original language | English |
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Article number | 5492298 |
Pages (from-to) | 804-817 |
Number of pages | 14 |
Journal | IEEE Transactions on Advanced Packaging |
Volume | 33 |
Issue number | 4 |
DOIs | |
State | Published - Nov 2010 |
Keywords
- $RLGC; extraction
- Cylindrical modal basis function
- excess capacitance
- integral equation
- interconnection modeling
- three-dimensional (3-D) integration
- through-silicon via (TSV)