Extremely low frequency-magnetic field (ELF-MF) exposure characteristics among semiconductor workers

Sangjun Choi, Wonseok Cha, Jihoon Park, Seungwon Kim, Won Kim, Chungsik Yoon, Juhyun Park, Kwonchul Ha, Donguk Park

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

We assessed the exposure of semiconductor workers to extremely low frequency-magnetic fields (ELF-MF) and identified job characteristics affecting ELF-MF exposure. These were demonstrated by assessing the exposure of 117 workers involved in wafer fabrication (fab) and chip packaging wearing personal dosimeters for a full shift. A portable device was used to monitor ELF-MF in high temporal resolution. All measurements were categorized by operation, job and working activity during working time. ELF-MF exposure of workers were classified based on the quartiles of ELF-MF distribution. The average levels of ELF-MF exposure were 0.56 µT for fab workers, 0.59 µT for chip packaging workers and 0.89 µT for electrical engineers, respectively. Exposure to ELF-MF differed among types of factory, operation, job and activity. Workers engaged in the diffusion and chip testing activities showed the highest ELF-MF exposure. The ELF-MF exposures of process operators were found to be higher than those of maintenance engineers, although peak exposure and/or patterns varied. The groups with the highest quartile ELF-MF exposure level are operators in diffusion, ion implantation, module and testing operations, and maintenance engineers in diffusion, module and testing operations. In conclusion, ELF-MF exposure among workers can be substantially affected by the type of operation and job, and the activity or location.

Original languageEnglish
Article number642
JournalInternational Journal of Environmental Research and Public Health
Volume15
Issue number4
DOIs
StatePublished - Apr 2018

Keywords

  • Extremely low frequency-magnetic fields (ELF-MF)
  • Fabrication (FAB) and chip packaging assembly
  • Semiconductors

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