Flexible Multi-Modal Sensor for Electronic Skin

Minhyun Jung, Sujaya Kumar Vishwanath, Jihoon Kim, Dae Kwan Ko, Myung Jin Park, Soo Chul Lim, Sanghun Jeon

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

Flexible sensors have been developed over the decades due to their potential in various applications. However, recent developments in interactive user interface, healthcare device, tactile sensor, and artificial electronic skin require device with multifunctional properties such as various detection ability and good mobility. Research on such devices are still under developing. In this report, we demonstrate a flexible multimodal (pressure, temperature) sensor using embedded indium tin oxide (ITO). For the pressure sensor, the embedded ITO was adopted as a conductive layer with triple layer pyramid structure. We utilized water-soluble sacrificial layers for eco-friendly method. The triple layer pyramid-structured pressure sensor shows excellent sensitivity in dynamic range of 100 Pa to 10 kPa with high reliability of 105 cycles. For the temperature sensor, we used comb like structure with ITO. It shows negative temperature coefficient on resistance with good linearity. Due to the vertically stacked structure, we were able to ignore interface effect. This work present that the opportunity of transparent electrode towards flexible multimodal sensors that can beemployed for various flexible applications.

Original languageEnglish
Title of host publicationFLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538693049
DOIs
StatePublished - Jul 2019
Event1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019 - Glasgow, United Kingdom
Duration: 7 Jul 201910 Jul 2019

Publication series

NameFLEPS 2019 - IEEE International Conference on Flexible and Printable Sensors and Systems, Proceedings

Conference

Conference1st IEEE International Conference on Flexible and Printable Sensors and Systems, FLEPS 2019
Country/TerritoryUnited Kingdom
CityGlasgow
Period7/07/1910/07/19

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