TY - JOUR
T1 - Flexible Multimodal Sensors for Electronic Skin
T2 - Principle, Materials, Device, Array Architecture, and Data Acquisition Method
AU - Jeon, Sanghun
AU - Lim, Soo Chul
AU - Trung, Tran Quang
AU - Jung, Minhyun
AU - Lee, Nae Eung
N1 - Publisher Copyright:
© 1963-2012 IEEE.
PY - 2019/10
Y1 - 2019/10
N2 - Electronic skin (e-skin) is designed to mimic the comprehensive nature of human skin. Various advances in e-skin continue to drive the development of the multimodal tactile sensor technology on flexible and stretchable platforms. e-skin incorporates pressure, temperature, texture, photographic imaging, and other sensors as well as data acquisition and signal processing units formed on a soft substrate for humanoid robots, wearable devices, and health monitoring electronics that are the most critical applications of soft electronics. This artificial skin has developed very rapidly toward becoming real technology. However, the complex nature of e-skin technology presents significant challenges in terms of materials, devices, sophisticated integration methods, and interference-free data acquisition. These challenges range from functional materials, device architecture, pixel design, array structure, and data acquisition method to multimodal sensing performance with negligible interference. In this article, we present recent research trends and approaches in the field of flexible and stretchable multimodal sensors for e-skin focusing on the following aspects: 1) flexible and stretchable platforms; 2) operating principles and materials suitable for pressure, temperature, strain, photograph, and hairy sensor devices; 3) device and integration architectures, including multimodal single cells, three-axis tactile sensors, vertical-stacked sensor arrays, active matrix sensor arrays, and integration electronics; 4) reliable acquisition methods for various texture sensing and machine-learning algorithms for processing tactile sensing data; and 5) future outlook.
AB - Electronic skin (e-skin) is designed to mimic the comprehensive nature of human skin. Various advances in e-skin continue to drive the development of the multimodal tactile sensor technology on flexible and stretchable platforms. e-skin incorporates pressure, temperature, texture, photographic imaging, and other sensors as well as data acquisition and signal processing units formed on a soft substrate for humanoid robots, wearable devices, and health monitoring electronics that are the most critical applications of soft electronics. This artificial skin has developed very rapidly toward becoming real technology. However, the complex nature of e-skin technology presents significant challenges in terms of materials, devices, sophisticated integration methods, and interference-free data acquisition. These challenges range from functional materials, device architecture, pixel design, array structure, and data acquisition method to multimodal sensing performance with negligible interference. In this article, we present recent research trends and approaches in the field of flexible and stretchable multimodal sensors for e-skin focusing on the following aspects: 1) flexible and stretchable platforms; 2) operating principles and materials suitable for pressure, temperature, strain, photograph, and hairy sensor devices; 3) device and integration architectures, including multimodal single cells, three-axis tactile sensors, vertical-stacked sensor arrays, active matrix sensor arrays, and integration electronics; 4) reliable acquisition methods for various texture sensing and machine-learning algorithms for processing tactile sensing data; and 5) future outlook.
KW - Electronic skin (e-skin)
KW - flexible and stretchable device
KW - multimodal sensor
KW - sensor network
KW - wearable device
UR - http://www.scopus.com/inward/record.url?scp=85073318360&partnerID=8YFLogxK
U2 - 10.1109/JPROC.2019.2930808
DO - 10.1109/JPROC.2019.2930808
M3 - Review article
AN - SCOPUS:85073318360
SN - 0018-9219
VL - 107
SP - 2065
EP - 2083
JO - Proceedings of the IEEE
JF - Proceedings of the IEEE
IS - 10
M1 - 8827484
ER -