Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	509-510
Number of pages	2
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	8
Issue number	4
DOIs	https://doi.org/10.1109/TCPMT.2018.2820397
State	Published - Apr 2018

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title = "Foreword: Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)",

author = "Han, \{Ki Jin\} and Seungyoung Ahn",

year = "2018",

month = apr,

doi = "10.1109/TCPMT.2018.2820397",

language = "English",

volume = "8",

pages = "509--510",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

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T1 - Foreword

T2 - Special Section on Recent Progress in the Electrical Design of Advanced Package and Systems (Part 2)

AU - Han, Ki Jin

AU - Ahn, Seungyoung

PY - 2018/4

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UR - https://www.scopus.com/pages/publications/85045440095

U2 - 10.1109/TCPMT.2018.2820397

DO - 10.1109/TCPMT.2018.2820397

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SP - 509

EP - 510

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

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