Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju; Woo Beom Choi; Yun Hi Lee; Sung Jae Jung; Nam Yang Lee; Jeong In Han; Kyoung Ik Cho; Myung Hwan Oh

doi:10.1016/s0026-2692(97)00119-5

Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju, Woo Beom Choi, Yun Hi Lee, Sung Jae Jung, Nam Yang Lee, Jeong In Han, Kyoung Ik Cho, Myung Hwan Oh

Department of Chemical and Biochemical Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO₂) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original language	English
Pages (from-to)	839-844
Number of pages	6
Journal	Microelectronics Journal
Volume	29
Issue number	11
DOIs	https://doi.org/10.1016/s0026-2692(97)00119-5
State	Published - Nov 1998

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10.1016/s0026-2692(97)00119-5

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title = "Glass-to-glass electrostatic bonding for FED tubeless packaging application",

abstract = "Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.",

author = "Ju, {Byeong Kwon} and Choi, {Woo Beom} and Lee, {Yun Hi} and Jung, {Sung Jae} and Lee, {Nam Yang} and Han, {Jeong In} and Cho, {Kyoung Ik} and Oh, {Myung Hwan}",

year = "1998",

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T1 - Glass-to-glass electrostatic bonding for FED tubeless packaging application

AU - Ju, Byeong Kwon

AU - Choi, Woo Beom

AU - Lee, Yun Hi

AU - Jung, Sung Jae

AU - Lee, Nam Yang

AU - Han, Jeong In

AU - Cho, Kyoung Ik

AU - Oh, Myung Hwan

PY - 1998/11

Y1 - 1998/11

N2 - Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

AB - Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

UR - http://www.scopus.com/inward/record.url?scp=0032209966&partnerID=8YFLogxK

U2 - 10.1016/s0026-2692(97)00119-5

DO - 10.1016/s0026-2692(97)00119-5

M3 - Article

AN - SCOPUS:0032209966

SN - 0026-2692

VL - 29

SP - 839

EP - 844

JO - Microelectronics Journal

JF - Microelectronics Journal

IS - 11

ER -

Glass-to-glass electrostatic bonding for FED tubeless packaging application

Abstract

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