Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju; Woo Beom Choi; Yun Hi Lee; Sung Jae Jung; Nam Yang Lee; Jeong In Han; Kyoung Ik Cho; Myung Hwan Oh

doi:10.1016/s0026-2692(97)00119-5

Glass-to-glass electrostatic bonding for FED tubeless packaging application

Byeong Kwon Ju
, Woo Beom Choi
, Yun Hi Lee
, Sung Jae Jung
, Nam Yang Lee
, Jeong In Han
, Kyoung Ik Cho
, Myung Hwan Oh

Department of Chemical and Biochemical Engineering

Korea Institute of Science and Technology
Ajou University
Electronics and Telecommunications Research Institute

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO₂) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original language	English
Pages (from-to)	839-844
Number of pages	6
Journal	Microelectronics
Volume	29
Issue number	11
DOIs	https://doi.org/10.1016/s0026-2692(97)00119-5
State	Published - Nov 1998

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10.1016/s0026-2692(97)00119-5

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@article{6a8a3eae59e04e939fec392d3852bf23,

title = "Glass-to-glass electrostatic bonding for FED tubeless packaging application",

abstract = "Two ITO-coated glass wafers (Corning \#7740, \#0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-\#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of \#7059-\#7059 and \#0080-\#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.",

author = "Ju, \{Byeong Kwon\} and Choi, \{Woo Beom\} and Lee, \{Yun Hi\} and Jung, \{Sung Jae\} and Lee, \{Nam Yang\} and Han, \{Jeong In\} and Cho, \{Kyoung Ik\} and Oh, \{Myung Hwan\}",

year = "1998",

month = nov,

doi = "10.1016/s0026-2692(97)00119-5",

language = "English",

volume = "29",

pages = "839--844",

journal = "Microelectronics",

issn = "0026-2692",

publisher = "Elsevier Ltd",

number = "11",

}

TY - JOUR

T1 - Glass-to-glass electrostatic bonding for FED tubeless packaging application

AU - Ju, Byeong Kwon

AU - Choi, Woo Beom

AU - Lee, Yun Hi

AU - Jung, Sung Jae

AU - Lee, Nam Yang

AU - Han, Jeong In

AU - Cho, Kyoung Ik

AU - Oh, Myung Hwan

PY - 1998/11

Y1 - 1998/11

N2 - Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

AB - Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

UR - https://www.scopus.com/pages/publications/0032209966

U2 - 10.1016/s0026-2692(97)00119-5

DO - 10.1016/s0026-2692(97)00119-5

M3 - Article

AN - SCOPUS:0032209966

SN - 0026-2692

VL - 29

SP - 839

EP - 844

JO - Microelectronics

JF - Microelectronics

IS - 11

ER -

Glass-to-glass electrostatic bonding for FED tubeless packaging application

Abstract

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