Heterodimensional technology for ultra low power electronics

  • W. C.B. Peatman
  • , M. Hurt
  • , R. Tsai
  • , T. Ytterdal
  • , H. Park
  • , J. Gonzales
  • , M. Shur

Research output: Contribution to conferencePaperpeer-review

Abstract

We describe new heterodimensional technology suitable for ultra low power applications. This technology uses Schottky barrier contacts between three-dimensional metal and two-dimensional electron gas. The low power performance is due to a small capacitance of the 2D-3D junction, the concentration of the depletion layer electric field streamlines in the active channel, suppression of parasitic resistance, small leakage current, and, most of all, due to the total elimination of the narrow channel effect which allows us to scale the device width to submicron dimensions. We present, compare, and discuss measured and simulated I-V and C-V characteristics for the 2D-3D Schottky diode, 2D MESFET and Schottky Gated 2D-3D RTT.

Original languageEnglish
Pages163-166
Number of pages4
StatePublished - 1995
EventProceedings of the 1995 3rd URSI International Symposium on Signals, Systems and Electronics, ISSSE'95 - San Francisco, CA, USA
Duration: 25 Oct 199527 Oct 1995

Conference

ConferenceProceedings of the 1995 3rd URSI International Symposium on Signals, Systems and Electronics, ISSSE'95
CitySan Francisco, CA, USA
Period25/10/9527/10/95

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