Abstract
Transparent hafnium indium zinc oxide thin-film transistors adopting single- and double-etch-stopper layers were evaluated. Compared to devices with a single SiOx etch stopper (ES) grown at 150 °C, a double ES with a second SiOx film grown at 350 °C provides a superior device performance such as improved subthreshold swing, threshold voltage, field effect mobility, and higher stability under a negative bias stress. The stretched-exponential analyses of the bias stress results indicate that the denser high-temperature SiOx protects more effectively the underlying semiconductor during the source/drain etch process and suppresses the generation of defect states therein.
Original language | English |
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Article number | 5565390 |
Pages (from-to) | 1248-1250 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 31 |
Issue number | 11 |
DOIs | |
State | Published - Nov 2010 |
Keywords
- Etch stopper (ES)
- hafnium indium zinc oxide (HIZO)
- thin-film transistor (TFT)