High-performance and stable transparent HfInZnO thin-film transistors with a double-etch-stopper layer

  • Joon Seok Park
  • , Tae Sang Kim
  • , Kyoung Seok Son
  • , Kwang Hee Lee
  • , Ji Sim Jung
  • , Wan Joo Maeng
  • , Hyun Suk Kim
  • , Eok Su Kim
  • , Kyung Bae Park
  • , Jong Baek Seon
  • , Jang Yeon Kwon
  • , Myung Kwan Ryu
  • , Sangyoon Lee

Research output: Contribution to journalArticlepeer-review

19 Scopus citations

Abstract

Transparent hafnium indium zinc oxide thin-film transistors adopting single- and double-etch-stopper layers were evaluated. Compared to devices with a single SiOx etch stopper (ES) grown at 150 °C, a double ES with a second SiOx film grown at 350 °C provides a superior device performance such as improved subthreshold swing, threshold voltage, field effect mobility, and higher stability under a negative bias stress. The stretched-exponential analyses of the bias stress results indicate that the denser high-temperature SiOx protects more effectively the underlying semiconductor during the source/drain etch process and suppresses the generation of defect states therein.

Original languageEnglish
Article number5565390
Pages (from-to)1248-1250
Number of pages3
JournalIEEE Electron Device Letters
Volume31
Issue number11
DOIs
StatePublished - Nov 2010

Keywords

  • Etch stopper (ES)
  • hafnium indium zinc oxide (HIZO)
  • thin-film transistor (TFT)

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