Abstract
High performance MIM devices on flexible plastic substrate were successfully fabricated without any defects such as distortion, crack, and blistering. In order to prevent these defects, newly developed design and process including buffer layer, water barrier, and low temperature post annealing (LTPA) below 150°C were applied, respectively. The uniformity and lifetime of the MIM device fabricated on 0.1 mm thick polycarbonate film were more than 92% and 10 years at applied field of 3 MV/cm, respectively.
Original language | English |
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Pages (from-to) | 403-406 |
Number of pages | 4 |
Journal | SID Conference Record of the International Display Research Conference |
State | Published - 2001 |
Event | Asia Display/IDW 2001 - Nagoya, Japan Duration: 16 Oct 2002 → 19 Oct 2002 |
Keywords
- Buffer layer
- Flexible substrate
- LTPA
- MIM
- Water barrier