Abstract
In this study, we investigated the resistive switching (RS) characteristics of ZrOx/HfOx bilayer-based resistive random-access memory (RRAM) devices. A 1.5-nm-thick HfOx layer was deposited by atomic layer deposition (ALD) between the ZrOx layer and TiN electrode to enhance the RS. Compared to the ZrOx single-layer device, the bilayer device exhibited a lower high resistance state (HRS) current, which improved endurance and reduced energy consumption due to the insulating HfOx layer. In addition, a DC endurance of 300 cycles and strong retention characteristics (10,000 s) were achieved in the bilayer device. Furthermore, the multi-level cell (MLC), potentiation, and depression characteristics were evaluated to demonstrate the suitability of the Ti/ZrOx/HfOx/TiN device for use as a neuromorphic device. With regard to potentiation and depression, various pulse schemes were employed to improve the asymmetric conductance changes for neuromorphic system applications.
| Original language | English |
|---|---|
| Article number | 171096 |
| Journal | Journal of Alloys and Compounds |
| Volume | 962 |
| DOIs | |
| State | Published - 5 Nov 2023 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 7 Affordable and Clean Energy
Keywords
- AI semiconductor
- Bilayer device
- Neuromorphic system
- Resistive switching
- Synaptic device
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