Indirect contact probing method for characterizing vertical interconnections in electronic packaging

Jongwoo Jeong, Jingook Kim, No Weon Kang, Ki Jin Han

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

This letter proposes a new indirect contact probing method to characterize vertical interconnections without contact damage. At the first step of the proposed technique, multiple one-port calibration measurements should be performed to characterize the contactor layer between the probe pads and the device-under-tests (DUTs). The characteristics of the actual vias as the DUTs are then extracted from indirect-contact measurements by de-embedding the contactor layer. In simulations and experiments at frequencies range from 2.5 to 18 GHz, we have verified via defects can be successfully identified from the indirect-contact measurements.

Original languageEnglish
Article number6960922
Pages (from-to)70-72
Number of pages3
JournalIEEE Microwave and Wireless Components Letters
Volume25
Issue number1
DOIs
StatePublished - 1 Jan 2015

Keywords

  • Calibration
  • de-embedding
  • non-contact measurement

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