Abstract
This letter proposes a new indirect contact probing method to characterize vertical interconnections without contact damage. At the first step of the proposed technique, multiple one-port calibration measurements should be performed to characterize the contactor layer between the probe pads and the device-under-tests (DUTs). The characteristics of the actual vias as the DUTs are then extracted from indirect-contact measurements by de-embedding the contactor layer. In simulations and experiments at frequencies range from 2.5 to 18 GHz, we have verified via defects can be successfully identified from the indirect-contact measurements.
Original language | English |
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Article number | 6960922 |
Pages (from-to) | 70-72 |
Number of pages | 3 |
Journal | IEEE Microwave and Wireless Components Letters |
Volume | 25 |
Issue number | 1 |
DOIs | |
State | Published - 1 Jan 2015 |
Keywords
- Calibration
- de-embedding
- non-contact measurement