Investigation of conduction mechanism in Ti/Si3N 4/p-Si stacked RRAM

Sunghun Jung, Sungjun Kim, Jeong Hoon Oh, Kyung Chang Ryoo, Jong Ho Lee, Hyungcheol Shin, Byung Gook Park

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The conduction mechanism in Ti/Si3N4/p-Si memory stack is described. In order to analyze the conduction mechanism, we measured the I-V characteristics in voltage sweep mode and conducted I-V curve fitting. And the temperature dependence in Ti/Si3N4/p-Si stacked cell is also investigated because we cannot claim the conduction mechanism just based on the I-V curve fitting. From I-V curve fitting and temperature measurement data, we found that space charge limited conduction (SCLC) model is well fitted in both high resistance state (HRS) and low resistance state (LRS).

Original languageEnglish
Title of host publicationProceedings of the 2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
Pages97-99
Number of pages3
DOIs
StatePublished - 2013
Event2013 IEEE 5th International Nanoelectronics Conference, INEC 2013 - Singapore, Singapore
Duration: 2 Jan 20134 Jan 2013

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2013 IEEE 5th International Nanoelectronics Conference, INEC 2013
Country/TerritorySingapore
CitySingapore
Period2/01/134/01/13

Keywords

  • RRAM
  • conduction mechanism and SiN)

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