Skip to main navigation Skip to search Skip to main content

Liner schemes of the aluminum damascene interconnection for sub-0.2 μm line pitch metallization

  • Sam Dong Kim
  • , Dae Gyu Park
  • SK Corporation

Research output: Contribution to journal › Article › peer-review

Fingerprint

Dive into the research topics of 'Liner schemes of the aluminum damascene interconnection for sub-0.2 μm line pitch metallization'. Together they form a unique fingerprint.
Sort by

Earth and Planetary Sciences

Physics

Engineering