Abstract
In this work, a novel self-aligned process utilizing non-selective, 02-enhanced wet thermal oxidation is presented for fabricating InP-based, ridge waveguide mid-infrared (λ=5.4 μm) quantum cascade lasers (QCLs) with a strain-compensated, 30-stage (1.53 μm thick) InGaAs/AlInAs active region, grown via metal organic chemical vapor deposition. This process, previously used in GaAs-based diode lasers containing low-Al content AlGaAs or even Al-free III-As alloys, forms a highly-insulating native oxide layer while simultaneously smoothing and passivating the etch-exposed active region, resulting in low-loss, strongly-confining waveguides. Here we report the first application of this process for directly oxidizing the deeply-etched QCL InGaAs/AlInAs active region ridge waveguide sidewalls and field (outside the ridge), eliminating the need for a deposited dielectric for electrical isolation, thus allowing self-aligned device fabrication. An 8 hour, 500 °C wet oxidation with 7000 ppm added O2 (relative to N2 carrier gas) yields a uniform oxide of∼350 nm in the field outside the ridge to ∼500 nm on the ridge sidewall. Laser devices tested under room temperature, pulsed excitation exhibit a threshold current density of Jth∼3.2 kA/cm2 for a 19.5 μm wide × 3 mm long stripe width.
| Original language | English |
|---|---|
| Article number | 72301O |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 7230 |
| DOIs | |
| State | Published - 2009 |
| Event | Novel In-Plane Semiconductor Lasers VIII - San Jose, CA, United States Duration: 26 Jan 2009 → 29 Jan 2009 |
Keywords
- Mid-infrared
- Nonselective wet oxidation
- Quantum cascade laser
- Ridge waveguide laser
- Strain-compensated
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