New vacuum packaging method of field emission display

B. K. Ju; W. B. Choi; S. J. Jeong; N. Y. Lee; J. I. Han; K. I. Cho; M. H. Oh

doi:10.1117/12.293566

New vacuum packaging method of field emission display

B. K. Ju
, W. B. Choi
, S. J. Jeong
, N. Y. Lee
, J. I. Han
, K. I. Cho
, M. H. Oh

Department of Chemical and Biochemical Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO ₂) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

Original language	English
Pages (from-to)	246-252
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	3242
DOIs	https://doi.org/10.1117/12.293566
State	Published - 1997
Event	Smart Electronics and MEMS - Adelaide, SA, Australia Duration: 11 Dec 1997 → 11 Dec 1997

Keywords

Electrostatic bonding
FED packaging
Glass-to-glass bonding
Interlayer

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10.1117/12.293566

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@article{3524cfc2e2264f8fbc72eb7c3638f860,

title = "New vacuum packaging method of field emission display",

abstract = "Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-\#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of \#7059-\#7059 and \#0080-\#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.",

keywords = "Electrostatic bonding, FED packaging, Glass-to-glass bonding, Interlayer",

author = "Ju, \{B. K.\} and Choi, \{W. B.\} and Jeong, \{S. J.\} and Lee, \{N. Y.\} and Han, \{J. I.\} and Cho, \{K. I.\} and Oh, \{M. H.\}",

year = "1997",

doi = "10.1117/12.293566",

language = "English",

volume = "3242",

pages = "246--252",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Smart Electronics and MEMS ; Conference date: 11-12-1997 Through 11-12-1997",

}

TY - JOUR

T1 - New vacuum packaging method of field emission display

AU - Ju, B. K.

AU - Choi, W. B.

AU - Jeong, S. J.

AU - Lee, N. Y.

AU - Han, J. I.

AU - Cho, K. I.

AU - Oh, M. H.

PY - 1997

Y1 - 1997

N2 - Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

AB - Two ITO-coated glass wafers are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO 2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.

KW - Electrostatic bonding

KW - FED packaging

KW - Glass-to-glass bonding

KW - Interlayer

UR - https://www.scopus.com/pages/publications/57649128376

U2 - 10.1117/12.293566

DO - 10.1117/12.293566

M3 - Conference article

AN - SCOPUS:57649128376

SN - 0277-786X

VL - 3242

SP - 246

EP - 252

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Smart Electronics and MEMS

Y2 - 11 December 1997 through 11 December 1997

ER -

New vacuum packaging method of field emission display

Abstract

Keywords

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