Ni electroless plating process for solder bump chip on glass technology

Jeong In Han, Sung Jei Hong

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

In the solder bump chip on glass process, for the connection of the driver chip to Al pad on the glass substrate, the process of the electroless plating was developed to coat Ni on Al/photoresist system. It is necessary to pretreat Al surface to remove the oxide layer before the plating. In order to find the pretreatment process which does not damage photoresist or the substrate glass, the alkaline and fluoridic zincate processes have been investigated. Because the photoresist and Al thin film could be easily dissolved in the alkaline solution, it was considered that the fluoridic zincate process was a suitable one. After immersion in the zincate solution containing 1.5g/l NH4HF2 and 100g/l ZnSO4, electroless Ni plating was performed well. The additives in the zincate solution and thiourea in the plating solution enhanced the flatness of deposited surface. Acid dip improved the uniformity of the surface.

Original languageEnglish
Pages (from-to)2091-2095
Number of pages5
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume36
Issue number4 A
DOIs
StatePublished - Apr 1997

Keywords

  • Bare chip
  • COG
  • LCD
  • Ni electroless plating
  • Solder bump
  • Zincation

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