Optimization of High-Speed Package Design on Statistical Domain

Il Joon Kim, Manho Lee, Ki Jin Han, Gyoungbum Kim, Dae Woo Kim, Dan Oh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper proposes an effective methodology to figure out the domain of design parameters for given electrical target specifications to have design rules for high-speed package design. Since the exact domain of the parameters is arbitrary and it is difficult to describe accurately, we change this problem by utilizing probability domain. Not only uniformly parametric sampling, but also Monte-Carlo sampling are simulated, and analyzed statistically on probability domain. An optimization algorithm maximizes the parameter domain for a target specification. LPDDR memory channel model constructed for parametric simulation include I/O interface and passive components. Computational script generator for HSPICE simulation is developed to perform parametric simulation and statistical analysis. During the procedure, the problem of using harsh computational burden due to a large number of samplings is resolved by reusing previously sampled data. The proposed methodology can provide a practical and quantitative guideline for high-speed package design. Moreover, the proposed modeling and analysis is unique methodology which is not tied to a specific topology such as conventional modeling and analysis.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages964-969
Number of pages6
ISBN (Electronic)9781728161808
DOIs
StatePublished - Jun 2020
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 3 Jun 202030 Jun 2020

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
Country/TerritoryUnited States
CityOrlando
Period3/06/2030/06/20

Keywords

  • LPDDR
  • Packaging
  • Signal Integrity
  • mobile DRAM
  • optimization
  • parametrization

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