Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems

Seoah Kim; Junyeong Kim; Min Su Kim; Jungsoo Park; Sungwook Mhin; Dongjin Kim

doi:10.1016/j.microrel.2023.115090

Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems

Seoah Kim
, Junyeong Kim
, Min Su Kim
, Jungsoo Park
, Sungwook Mhin
, Dongjin Kim

Department of Energy and Materials Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

This study focuses on Ag die bonding failure physics and high-temperature reliability that the die back-side and substrate surface are both finished ENIG when power modules are embedded in-wheel motor systems. The thermal reliability of the Ag sintered die-bonded structures was harsh thermal aging tested for up to 500 h at 250 °C. We systematically investigated the degradation mechanism generated during the thermal endurance test at 250 °C of the die-attach structure bonded with Ag sinter at a very low temperature of 175 °C by EBSD analysis.

Original language	English
Article number	115090
Journal	Microelectronics Reliability
Volume	150
DOIs	https://doi.org/10.1016/j.microrel.2023.115090
State	Published - Nov 2023

Keywords

EBSD
In-wheel motor systems
Low temperature die bonding
Nanoscale Ag joining
Power electronics

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10.1016/j.microrel.2023.115090

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title = "Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems",

abstract = "This study focuses on Ag die bonding failure physics and high-temperature reliability that the die back-side and substrate surface are both finished ENIG when power modules are embedded in-wheel motor systems. The thermal reliability of the Ag sintered die-bonded structures was harsh thermal aging tested for up to 500 h at 250 °C. We systematically investigated the degradation mechanism generated during the thermal endurance test at 250 °C of the die-attach structure bonded with Ag sinter at a very low temperature of 175 °C by EBSD analysis.",

keywords = "EBSD, In-wheel motor systems, Low temperature die bonding, Nanoscale Ag joining, Power electronics",

author = "Seoah Kim and Junyeong Kim and Kim, \{Min Su\} and Jungsoo Park and Sungwook Mhin and Dongjin Kim",

note = "Publisher Copyright: {\textcopyright} 2023",

year = "2023",

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doi = "10.1016/j.microrel.2023.115090",

language = "English",

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T1 - Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems

AU - Kim, Seoah

AU - Kim, Junyeong

AU - Kim, Min Su

AU - Park, Jungsoo

AU - Mhin, Sungwook

AU - Kim, Dongjin

PY - 2023/11

Y1 - 2023/11

N2 - This study focuses on Ag die bonding failure physics and high-temperature reliability that the die back-side and substrate surface are both finished ENIG when power modules are embedded in-wheel motor systems. The thermal reliability of the Ag sintered die-bonded structures was harsh thermal aging tested for up to 500 h at 250 °C. We systematically investigated the degradation mechanism generated during the thermal endurance test at 250 °C of the die-attach structure bonded with Ag sinter at a very low temperature of 175 °C by EBSD analysis.

AB - This study focuses on Ag die bonding failure physics and high-temperature reliability that the die back-side and substrate surface are both finished ENIG when power modules are embedded in-wheel motor systems. The thermal reliability of the Ag sintered die-bonded structures was harsh thermal aging tested for up to 500 h at 250 °C. We systematically investigated the degradation mechanism generated during the thermal endurance test at 250 °C of the die-attach structure bonded with Ag sinter at a very low temperature of 175 °C by EBSD analysis.

KW - EBSD

KW - In-wheel motor systems

KW - Low temperature die bonding

KW - Nanoscale Ag joining

KW - Power electronics

UR - https://www.scopus.com/pages/publications/85174637277

U2 - 10.1016/j.microrel.2023.115090

DO - 10.1016/j.microrel.2023.115090

M3 - Article

AN - SCOPUS:85174637277

SN - 0026-2714

VL - 150

JO - Microelectronics Reliability

JF - Microelectronics Reliability

M1 - 115090

ER -

Physics of failure and high-temperature reliability on Ag sintered ENIG finished die-attachments at 175 °C for integration of in-wheel motor systems

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Keywords

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