@inproceedings{48b0643ef19142f494d093d63460e1ee,
title = "Printability Evaluation of Water-Soluble Type 7 Solder Paste for Fine pitch Advanced Package Interconnects",
abstract = "This study evaluates the printability and solderability of water-soluble, Type 7 solder paste for fine-pitch interconnects in advanced packaging applications. Fluxes were formulated using sebacic acid and suberic acid as activators, and three fluxes and solder pastes were produced. From the wetting balance test and viscosity evaluations, the flux and paste containing sebacic acid (Paste-A) exhibited the highest flux activity, while the flux containing suberic acid (Paste-B), provided better stability with lower flux activity. Printability evaluations demonstrated that Paste-A and Paste-C which both sebacic and suberic acid was included showed excellent performance at fine pitches (down to 0.08 mm), with no slumping or bridging observed, whereas Paste-B showed dewetting and bridging at 0.08mm pitch. The results suggest that sebacic acid improves printability and wettability, but increases viscosity over time, while suberic acid enhances stability at the cost of reduced printability.",
author = "Choi, {Dong Gyu} and Park, {Si Hun} and Sungwook Mhin and Hong, {Won Sik} and Sehoon Yoo",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 26th Electronics Packaging Technology Conference, EPTC 2024 ; Conference date: 03-12-2024 Through 06-12-2024",
year = "2024",
doi = "10.1109/EPTC62800.2024.10909844",
language = "English",
series = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "774--777",
editor = "Sunmi Shin and Toh, {Chin Hock} and Lim, {Yeow Kheng} and Vivek Chidambaram and Chui, {King Jien}",
booktitle = "Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024",
address = "United States",
}