Robust method for analysis of power distribution networks

Ki Jin Han, Bill Martin, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper we provide a method that can be used to analyze power distribution networks with electromagnetic accuracy. The method is applicable to any power distribution network in the chip, package or printed circuit board (PCB). The method can also be used to compute the interaction of the power distribution network between various domains. We provide examples to validate this approach.

Original languageEnglish
Title of host publication2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages213-216
Number of pages4
ISBN (Electronic)9781467380997
DOIs
StatePublished - 14 Jan 2016
EventIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 - Seoul, Korea, Republic of
Duration: 14 Dec 201516 Dec 2015

Publication series

Name2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015

Conference

ConferenceIEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015
Country/TerritoryKorea, Republic of
CitySeoul
Period14/12/1516/12/15

Keywords

  • chip
  • impedance
  • package
  • PCB
  • Power distribution

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