@inproceedings{0a45c7a7a43243988cab210abb524262,
title = "Robust method for analysis of power distribution networks",
abstract = "In this paper we provide a method that can be used to analyze power distribution networks with electromagnetic accuracy. The method is applicable to any power distribution network in the chip, package or printed circuit board (PCB). The method can also be used to compute the interaction of the power distribution network between various domains. We provide examples to validate this approach.",
keywords = "chip, impedance, package, PCB, Power distribution",
author = "Han, {Ki Jin} and Bill Martin and Madhavan Swaminathan",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 ; Conference date: 14-12-2015 Through 16-12-2015",
year = "2016",
month = jan,
day = "14",
doi = "10.1109/EDAPS.2015.7383713",
language = "English",
series = "2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "213--216",
booktitle = "2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015",
address = "United States",
}