Sputter-deposited La 2O 3 on p-GaAs for gate dielectric applications

T. Das, C. Mahata, C. K. Maiti, G. K. Dalapati, C. K. Chia, D. Z. Chi, S. Y. Chiam, H. L. Seng, C. C. Tan, H. K. Hui, G. Sutradhar, P. K. Bose

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28 Scopus citations

Abstract

The interfacial and electrical properties of RF sputtered La 2O 3 on p-GaAs substrates with and without ultrathin Si interface passivation layer (IPL) are reported. X-ray photoelectron spectroscopy (XPS) studies revealed the formation of thermally stable interfacial native oxide (Ga-oxide and As-oxide) for La 2O 3Sip-GaAs gate stacks. The presence of (La 2O 3) 1-x(SiO 2) x at the interface prevented the formation of La-hydroxide which improved the metal-oxide-semiconductor (MOS) device characteristics, such as interface state density (∼1.2 × 10 12eV -1cm -2), frequency dispersion (∼7), and hysteresis voltage (∼260 mV). A gate leakage current density of 1.1 × 10 -5 A.cm -2 has been achieved at V fb-1 V for an equivalent oxide thickness of 3.4 nm and small flat-band voltage instability under constant voltage stressing was observed. The electrical properties of AlLa 2O 3Sip-GaAs MOS capacitors were found to improve after post deposition annealing at 500°C.

Original languageEnglish
Pages (from-to)G15-G22
JournalJournal of the Electrochemical Society
Volume159
Issue number2
DOIs
StatePublished - 2012

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