Sputter-deposited La 2O 3 on p-GaAs for gate dielectric applications

  • T. Das
  • , C. Mahata
  • , C. K. Maiti
  • , G. K. Dalapati
  • , C. K. Chia
  • , D. Z. Chi
  • , S. Y. Chiam
  • , H. L. Seng
  • , C. C. Tan
  • , H. K. Hui
  • , G. Sutradhar
  • , P. K. Bose

Research output: Contribution to journalArticlepeer-review

30 Scopus citations

Abstract

The interfacial and electrical properties of RF sputtered La 2O 3 on p-GaAs substrates with and without ultrathin Si interface passivation layer (IPL) are reported. X-ray photoelectron spectroscopy (XPS) studies revealed the formation of thermally stable interfacial native oxide (Ga-oxide and As-oxide) for La 2O 3Sip-GaAs gate stacks. The presence of (La 2O 3) 1-x(SiO 2) x at the interface prevented the formation of La-hydroxide which improved the metal-oxide-semiconductor (MOS) device characteristics, such as interface state density (∼1.2 × 10 12eV -1cm -2), frequency dispersion (∼7), and hysteresis voltage (∼260 mV). A gate leakage current density of 1.1 × 10 -5 A.cm -2 has been achieved at V fb-1 V for an equivalent oxide thickness of 3.4 nm and small flat-band voltage instability under constant voltage stressing was observed. The electrical properties of AlLa 2O 3Sip-GaAs MOS capacitors were found to improve after post deposition annealing at 500°C.

Original languageEnglish
Pages (from-to)G15-G22
JournalJournal of the Electrochemical Society
Volume159
Issue number2
DOIs
StatePublished - 2012

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