Surface passivation of GaAs substrates with SiO2 deposited using ALD

  • G. K. Dalapati
  • , C. K. Chia
  • , C. Mahata
  • , T. Das
  • , C. K. Maiti
  • , M. K. Kumar
  • , H. Gao
  • , S. Y. Chiam
  • , C. C. Tan
  • , C. T. Chua
  • , Y. B. Cheng
  • , D. Z. Chi

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

Feasibility of using atomic layer deposited (ALD) silicon dioxide (SiO 2) as interface passivation layer in bulk-GaAs and epitaxial-GaAs (epi-GaAs) substrate is studied. The interfacial reaction mechanisms of ALD SiO2 on bulk-GaAs and epi-GaAs are studied using x-ray photoelectron spectroscopy (XPS), high-resolution transmission electron microscopy (HRTEM), and electrical measurements. Higher oxidation states of Ga (Ga2+, Ga3+) and As-O bonding are found to get effectively suppressed in ALD SiO2/GaAs structures after post deposition annealing. Capacitance-voltage characteristics of the TaN/ALD SiO2/p-GaAs gate stack show low hysteresis (∼ 30 mV) compared to ALD HfO2 on bulk p-GaAs.

Original languageEnglish
Pages (from-to)G52-G55
JournalElectrochemical and Solid-State Letters
Volume14
Issue number10
DOIs
StatePublished - 2011

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