Abstract
Feasibility of using atomic layer deposited (ALD) silicon dioxide (SiO 2) as interface passivation layer in bulk-GaAs and epitaxial-GaAs (epi-GaAs) substrate is studied. The interfacial reaction mechanisms of ALD SiO2 on bulk-GaAs and epi-GaAs are studied using x-ray photoelectron spectroscopy (XPS), high-resolution transmission electron microscopy (HRTEM), and electrical measurements. Higher oxidation states of Ga (Ga2+, Ga3+) and As-O bonding are found to get effectively suppressed in ALD SiO2/GaAs structures after post deposition annealing. Capacitance-voltage characteristics of the TaN/ALD SiO2/p-GaAs gate stack show low hysteresis (∼ 30 mV) compared to ALD HfO2 on bulk p-GaAs.
| Original language | English |
|---|---|
| Pages (from-to) | G52-G55 |
| Journal | Electrochemical and Solid-State Letters |
| Volume | 14 |
| Issue number | 10 |
| DOIs | |
| State | Published - 2011 |