Thermal curing property of silicone encapsulant containing quantum dot surrounded by various types of ligands

Chae Sung Lee, Beom Jong Kim, Seongun Jeon, Cheul Jong Han, Sung Kyu Hong

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

In this study, the silicone thermal curing degree of the silicone-encapsulated quantum dot light emission diode was measured using the various types of chemical ligands around quantum dot. It was confirmed that the trioctyl phosphin oxide (TOPO) ligand around the quantum dot was responsible for dispersion of the quantum dot in silicone encapsulant and decline of the thermal curing degree of the silicone encapsulant. Also, it was confirmed that the thermal curing degree of silicone encapsulants containing the steric acid (SA) and the dodecanoic acid (DA) ligands were higher than the one of TOPO ligand.

Original languageEnglish
Pages (from-to)3787-3789
Number of pages3
JournalBulletin of the Korean Chemical Society
Volume34
Issue number12
DOIs
StatePublished - 20 Dec 2013

Keywords

  • Ligand
  • Quantum dot
  • Silicone encapsulan
  • Thermal curing degree
  • TOPO

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