Thermal curing property of silicone encapsulant containing quantum dot surrounded by various types of ligands
- Chae Sung Lee
- , Beom Jong Kim
- , Seongun Jeon
- , Cheul Jong Han
- , Sung Kyu Hong
- Dongguk University
- Korea Electronics Technology Institute
Research output: Contribution to journal › Article › peer-review
4
Scopus
citations