Ultra-stacked Forksheet-FET and Monolithic Complementary-FET for Å7~5 node Visibility

J. Lee, S. Eom, M. Kim, Y. Ahn, S. Lee, J. Jeong, S. Lee, R. H. Baek

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

For the first time, we comprehensively compared the competitiveness of ultra-stacked forksheet-FET (FS) and monolithic complementary-FET (CF) for Å7~5 nodes. Assuming nanosheet-FET (NS) in Å10 node, ultra-stacked (>4) FS does not show meaningful area scaling over 4stack FS (FS4) in high-density (HD) applications of Å7. However, in high-performance (HP) of Å7, FS5 shows a large scaling over FS4 with small performance (Perf) degradation. CF3 still has a smaller area than FS5 but has worse Perf and larger process cost (PC), undermining the PPAC (Power-Perf-Area-Cost) of CF3. In Å5, however, FS can be replaced by CF4 or functional symmetry CF (CFS) in terms of PPA.

Original languageEnglish
Title of host publication2024 IEEE International Electron Devices Meeting, IEDM 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350365429
DOIs
StatePublished - 2024
Event2024 IEEE International Electron Devices Meeting, IEDM 2024 - San Francisco, United States
Duration: 7 Dec 202411 Dec 2024

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Conference

Conference2024 IEEE International Electron Devices Meeting, IEDM 2024
Country/TerritoryUnited States
CitySan Francisco
Period7/12/2411/12/24

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